EGIDE

EGIDE designs and manufactures hermetic packages destined to protect and interconnect several kinds of electronic or photonic chips, which are sensitive to harsh thermal, atmospheric or magnetic environments as can be encountered in space, aeronautic, military, telecommunications and industrial applications.

EGIDE’s products are the result of a complex expertise, drawing upon several disciplines: material structure, (particularly special alloys), chemistry and surface treatment, mechanics, thermodynamics, electronics, opto-electronics and microwave modeling.

EGIDE is one of the few companies to master all technologies surrounding the two types of materials used for these packages in the world today: glass-to-metal and ceramics. The company manufactures its own HTCC ceramics and, thanks to its English and American subsidiaries, produces its molded metallic components and glass beads internally.

 

 

• 15th June 2009
  Space Research projects under the 7th Framework Programme for Research

• 25th/29th May 2009
  International Conference on High Performance Powder Metallurgy Materials.