PLANSEE

PLANSEE High Performance Materials (HPM), a multinational company with its research center in Austria, is one of the worlds leading manufacturers of refractory metals and special materials made by powder metallurgy. PLANSEE HPM is member of the PLANSEE Group with more than employs 5000 people worldwide. Application fields of PLANSEE HPM materials are for instance lighting technology, electronics including thermal management, medical and coating technology as well as power engineering. Rapid growth in multimedia networks and wireless communication systems together with new developments in photonics, power electronics and microelectronics are causing an ever-increasing demand for advanced thermal management solutions. PLANSEE has extended its established electronic materials and product portfolio (Mo, W, CuW, MoCu, Cu/MoCu/Cu) by new metal-diamond composite materials (MDC).

The outstanding feature of emerging MDC's is the combination of superior thermal conductivity (450-650 W/mK) with a coefficient of thermal expansion (CTE) matching the CTE of most semiconductor substrates. In 2007 PLANSEE HPM has installed a production line for MDC's in Reutte, Austria. This is dedicated to the fabrication of these composites by infiltration as well as machining and coating processes.

In the framework of AGAPAC PLANSEE will lead WP3 and furthermore deliver base plates made of metal-diamond composites. From a material point of view these base plates will be one key element for the proper operation of the complete package.

 

 

• 15th June 2009
  Space Research projects under the 7th Framework Programme for Research

• 25th/29th May 2009
  International Conference on High Performance Powder Metallurgy Materials.